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MJ BGA Reballing Solder Stencil Plant Tin Net for MTK CPU OPTION:MT-2 Machine Power: 200W

SKU: 956010331

4.6
USD21.42 USD43.42

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Ships within 48 hours · Estimated delivery Aug 4 - Aug 9

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MJ BGA Reballing Solder Stencil Plant Tin Net for MTK CPU OPTION:MT-2 Machine Power: 200WPRODUCT INTRODUCTIONType: Hand Tool PartsOrigin: CN(Origin)is_customized: NoMaterial: Aluminium copper AlloyUsage: Commercial Manufacture PRODUCT FEATURES* Stepped groove design enables stencil to align with the tinning position of ic rapidly.* The square holes design makes it easier to take out the formed solder balls.* The high success rate of planting tin, the solder balls can be formed once after you are proficient.

Store: juliusking.com · Domain: juliusking.com

Description

Machine Power: 200W

Put the sillica gel on the heated plate holes to holes

Bamboo material

four foot silicone pad anti-skid

Gas flow rate:100 litres/minute

MJ BGA Reballing Solder Stencil Plant Tin Net for MTK CPU OPTION:MT-2 Machine Power: 200WPRODUCT INTRODUCTIONType: Hand Tool PartsOrigin: CN(Origin)is_customized: NoMaterial: Aluminium copper AlloyUsage: Commercial Manufacture PRODUCT FEATURES* Stepped groove design enables stencil to align with the tinning position of ic rapidly.* The square holes design makes it easier to take out the formed solder balls.* The high success rate of planting tin, the solder balls can be formed once after you are proficient.

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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